The Mushkin Heatspreader

The XP2-5300 uses a new aero-efficient heatspreader design developed by Mushkin. As we covered in our tech report of Mushkin's new heatspreaders, these heatspreaders use an open top design.

This improves the module's thermal dissipation by allowing air to flow beneath the heatspreaders and around the memory chips. This is especially true if you are using a fan to blow across the module.

The new design also increased the surface area for thermal dissipation by 58%. The new heatsink can therefore dissipate more heat than the standard heatspreader used by Mushkin in the past.

These side views of the memory module will show you just how "roomy" the new heatspreader is.

Left side view	Right side view

You can also see that Mushkin used a full-sized thermal tape that is much larger than the chip. But unlike what we saw with OCZ Technology's new XTC heatspreaders, the overly large thermal tapes do not impede air flow.

The Thermal Tape

Mushkin has also started using a new thermal adhesive tape which they claim has twice the thermal conductivity of the thermal tape they used in their older modules.

If what they claim is true, then heat from the memory chips will radiate much faster to the heatspreaders. This will be particularly useful if you intend to overclock these modules, even more so if you want to overvolt them!