Add to Reddit
Heat Spreader
If you look closely, you can just see the profile of the Samsung TCCD chips. Thermal tape was used to attached the heat speader to the memory chips.
)
Inspecting both modules, we did not find any loss of contact between the heat spreader and the memory chips. All memory chips were in good contact with the heat spreader.
The Memory Chip
)
Kingston
uses Samsung K4H560838F-TCCD memory chips in these HyperX modules.
Note that Mushkin uses the same memory chips in their PC3200
222 LII V2 modules.
The Samsung TCCD chip is a 256 Mbit chip with an access time of 4.0ns. It was originally designed to run at 166MHz at CL2.5 but the new revision CD chips are rated for 250MHz operation at a timing of 3-4-4. Translated into DDR terms, that's a maximum speed of 500MHz DDR at 3-4-4-8.
However, Kingston did not pick these memory chips to run them at 500MHz at latencies of 3-4-4-8. They instead, chose to run them at just 200MHz, albeit at the very low latencies of 2-2-2-5! So, in theory at least, these modules should be able to run at 500MHz at higher latencies.
Memory Chip Specifications
|
Chip Capacity |
256 Mbit |
|
Configuration |
8M x 4 banks x 8 bits |
|
SDRAM
Speed Grade |
4.0 ns |
|
Rated
Memory Clock |
250 MHz |
|
Data Transfers
Per Clock |
2 |
|
Supported
CAS Latencies |
2.0, 2.5, 3.0 |
|
Refresh
Rate |
7.8 µs |
|
I/O Voltage |
2.6 V ± 0.10 V |
|
Operating
Temperature |
0 to 70 °C |
|
Power
Dissipation |
NA |
The specifications above were from Samsung's datasheet on the K4H560838F-TCCD
(note that information on the -CD modules are not publicly available on Samsung's site just yet)
<<< The Module, Module Specifications : Previous Page | Next Page : Testing Methodology, Test Bed >>>
