Special Features (Taken From VICS Technology)
A. Shielding Material from Copper to Aluminum
Aluminum can defend the noise from the band frequency of HDD data transfer and
have an excellent shielding performance. This report is based from http//www.seiwa.co.jp/enterprise/emc/pdf/b-p31-32.pdf
In this conclusion, we use aluminum for noise shielding, in replace of copper materials, and covered it with mira to maintain its glittering silver color.
B. Each layer is placed with an Aluminum Shield
RD3XP is made from ATA 100/133 High impedance flat cable cut into 8 layers of
10 cable wires, with a ground wire and signal wire alternatively, and folded
in zigzag-piled so that each signal wire is surrounded by 4 ground wires.
The problem usually with flat cable is the inability to avoid crosstalk, which is the interference between two cables causing undesirable signals induced from one cable to another, which may lead to possible bit errors that delays data transmission process. Most cable makers ignore this matter, not realizing the serious effect it caused, but with the RD3XP design, folded 8 layers with 10 wires and placing an aluminum shield for each layer could definitely refrain your cable from crosstalk dilemma.
C. Super Anti-Noise Device
The figure on the right shows the test result of the RD3XP tested by Taiwan
Electronics Testing Center (ETC), a semi-government testing laboratory. The
test method is done by comparing RD3XP with a regular ATA-100/133 flat cable
and tested both by using a testing device that generates noise and inserted
into the connector then they measure the noise radiation frequency of the cable.
The result shows that RD3XP is, at least, 10dB lower than the general ATA 100/133
flat cable. The lower frequency level it perform, the lesser noise it radiated.
Sound Quality Effect
With the special design of RD3XP, it serves as an anti-noise device for it blocks
the noise from coming out and furthermore protecting other devices from being
affected thus bringing out the original audible sound to your pc.
D. Flexibility
RD3XP is made more flexible and comfortable to use. It maintains an even more
complex configuration. Easy to plug and unplug without causing extra tension
to the cable.
E. Using Mira and Conductive Fabric Tape
Copper shielding material could easily rip out caused by the tension of bending
the cable and also the adhesive of the copper is not strong enough to stick
to the cable, thus detaching it easily from cable. Replacing copper to aluminum
with mira covering strengthens the shielding function and achieve progressive
performance and by using an electrical fabric tape can secure extra protection.
F. External Black Metal Mesh Covering
The inner grounding metal mesh shield is noticeable through the braid gap of
the nylon covering giving a more presentable outlook to the cable.
Our system side connector use red color but does not indicate a technical defined spec but most motherboard the supports ATA 100/133 use red connector. (We still use black for the master connector and gray for the slave connector)
G. New Packaging Style
Paper box with window allows a visible view of the inner content completely.
Switching plastic packaging to paper box expresses an awareness of environmental
protection.
RD3 (Including RD3XP) possess certain characteristics that cannot be found in other cable.
Furnish with High Impedance Cable
High Impedance is made from a Thermoplastic Elastomer (TPE) insulation material.
Ordinary cables are coated with PVC materials that are incapable of avoiding
crosstalk and reflection problem. Thermoplastic Elastomer material could be
identified by its yellow color, PVC in gray color and TPO, a medium performance
of TPE & PVC, in white color. The recent cable banded in black color is
also made from PVC material. The price of TPE cable itself is twice as much
as PVC.
Design to Improve Airflow
The thinnest section is only 9*8mm compared to the existing ATA 100/133 round
cable has been reduced for at least 30% (Researched by VICS Technology). Used
boots for connector parts for smoother airflow.