Heatspreader
Unlike the Pro series, the XMS4400 modules are much smaller and come with platinum-coloured aluminium heatspreaders. This is why Corsair called this series the 'Platinum' series. However, there's no difference between the Platinum series and the Black series, other than the colour of the heatspreader.
The heatspreaders are tightly stuck onto the RAM chips. Like the modules we have reviewed in the past, Corsair used thermal tape to attach the heatspreader onto the modules; and a metal clip holds the heatspreader to prevent accidental removal.
It's very difficult to remove the heatspreaders and you risk damaging the module. Please note that removing the heatspreader automatically voids the module's lifetime warranty. So, don't attempt it unless you absolutely MUST peek at the memory chips.
The Memory Chip
It's not surprising to see that all current low latency memory modules are powered by popular Samsung K4H560838F-TCCD chips. This DDR SDRAM chip is easily the most versatile memory chip in the market now.
Not only is it capable of supporting very tight timings at DDR400, it is also very capable of scaling to a much higher memory speed at slightly looser timings. Running at DDR600 is actually not uncommon.
It is a 256Mbit chip with an access time of 4.0ns. Originally designed to run at 166MHz at CL 2.5, the new CD revision chips are rated for 250MHz operation at the timings of 3-4-4. Translated into DDR terms, that's a maximum speed of 500MHz DDR at 3-4-4-8.
Of course, Corsair is not going to follow the official specifications! These chips are specially hand-picked and pre-tested to run at DDR550 at 2.5-4-4-8!
Let's have a look at the official specification of the Samsung K4H560838F-TCCD.
Memory Chip Specifications
Chip Capacity |
256 Mbit |
Configuration |
8M x 4 banks x 8 bits |
SDRAM
Speed Grade |
4.0 ns |
Rated
Memory Clock |
250 MHz |
Data Transfers
Per Clock |
2 |
Supported
CAS Latencies |
2.0, 2.5, 3.0 |
Refresh
Rate |
7.8 µs |
I/O Voltage |
2.5 - 2.7 V |
Operating
Temperature |
0 to 70 °C |
Power
Dissipation |
NA |
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