Aero-Efficient Design

Mushkin's new design boasts of improved aero-efficiency. Basically, they opened up the top of the heatsink so that air can better circulate under the heatsink.

Current heatsink design closes off the top as well as the sides, so air cannot circulate properly under the heatsink. This new design certainly looks airy!

They also extended the top of the heatsink to create a circular tunnel. You can see it in the picture below.

This not only allows better aeration (thanks to the semi-circular holes) but it also increases the surface area for better thermal dissipation.

Advanced Thermal Adhesive

The new heatsink also comes with better thermal adhesives. According to Mushkin, the new thermal adhesive used has double the thermal conductivity of the older adhesive used.

If that's true, then the new heatsink will be able to absorb and dissipate heat from the memory chips much faster than the standard heatspreader used in current memory modules. This will be important if you are interested in overclocking your memory modules, especially if you are also overvolting them!