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The Intel-Micron 3D XPoint Technology Report
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The Intel-Micron 3D XPoint Technology Report

On the 29th of July 2015, Intel Corporation and Micron Technology Inc. unveiled the culmination of a decade's worth of joint effort in developing new memory technologies - the 3D XPoint memory technology!

Pronounced as "three-dee cross point", the 3D XPoint memory is a new class of non-volatile memory, designed to replace NAND flash memory. It is up to 1,000 times faster with up to 1,000 times greater endurance than NAND flash memory. On top of that, it is 10 times denser than DRAM memory.

Intel Micron 3D XPoint Technology Report

Amazing? It's REVOLUTIONARY! Let's take a look at 3D XPoint and see how it accomplishes all that...

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An Intel-Micro Collaborative Effort

Before we continue, we should note that the 3D XPoint technology is still in development. Therefore, everything revealed in this article is subject to change.

Intel Micron 3D XPoint Technology Report

Our hosts for this launch event were Rob Crooke, Senior Vice-President, Non-Volatile Memory Solutions, Intel; and Scott DeBoer, Vice President, Research and Development, Micron.

Intel Micron 3D XPoint Technology Report

Intel and Micron have been working together on new memory technologies since 2005. After researching several potential memory technologies, they began focusing aggressively on developing the 3D XPoint memory technology in 2012.

Intel Micron 3D XPoint Technology Report

Commercial development of the 3D XPoint memory technology began in Micron's Boise, Idaho fab facility in 2012. When unveiled today, it represented the culmination of a decade's worth of collaborative research on new memory technologies by Intel and Micron.

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Page

The Intel-Micron 3D XPoint Technology Report

1

Introduction, An Intel-Micro Collaborative Effort

2

Revolutionary, How Does 3D XPoint Accomplish That?

3

Press Release, Key Points & Infographics

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